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2016 - 04 - 15
■ Chip   23,500CPH chip (Laser centering/Optimum)  18,500CPH (Laser centering / IPC9850) ■ IC  9,000CPH (Vision centering/MNVC option)  ■ From 0402(01005) to 33.5mm ...
2013 - 12 - 16
应用领域:IGBT模块、MEMS封装、大功率器件封装、光电器件封装、气密性封装等。1、观察系统:腔体带可视窗口, 可实时观察焊接过程,2、加热系统:设备可配置6套加热系统,分别在真空环境下进行工作,互不干扰影响,提高生产效率3、上、下加热系统,配置电流调节器,可分别进行高精度动态温度控制,同时保证承载台温度均匀度。4、真空系统:设备配置直联高速旋片式真空泵,可快速实现炉腔达到0.1mbar高真空环...
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