High speed Universial Placement Machine KE-2060R - Beijing Chengliankaida Technology.co.,LTD

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The twenty-first Southern China international electronic production equipment, the microelectronics industry exhibition (NEPCON)Time: August 25, 2015 -27 daysAddress: Shenzhen International Convention...

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Electronic production equipment exhibition, Shanghai, Munich, 2015

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Electronic production equipment exhibition, Shanghai, Munich, 2015:Time: March 17, 2015 -19 daysLocation: Chinese - Shanghai New International Expo Center Hall E2 E1, our booth No.: E1, booth 1316A wa...

Welcome to April 2015 NEPCON (China international electronic production equipment exhibition)

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April 2015 NEPCON (China International Electronic Equipment Exhibition):Time: April 21, 2015 -23Venue: Shanghai World Expo exhibition hall 1. (No. 7, No. 8 line available)Exhibition hall: hall 1, visi...

Welcome to visit on June 20th 2015 guangzhou international lighting fair

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Guangzhou international lighting fair in June, 2015:Time: June 9-12, 2015Location: guangzhou (the China import and export fair pazhou hall)Gallery: D16 # 9.1JUKI SMT machine cheng lian kai da technolo...

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产品名称： High speed Universial Placement Machine KE-2060R

上市日期：2007-12-13

Product Parameter
Product Scope
Explanation
Product description
Configuration

Specifications:

Substrate size : 4 kinds of substrate are optional 330 x 250 mm / 410 * 360 mm / 510 * 360 mm / 510 * 460 mm .

Element size laser identification chip 0603 (0201) inch chip ~ 33.5 mm square element;

Image recognition 1.0 x 0.5 mm * 2 , party components or 50 ~ 74 mm x 74 mm (0402 (01005)

Components SMT speed chip components : 12500 CPH * 3; IC element 1850 3400 CPH CPH * 3 * 4 * 5

SMT precision laser identification : + / - 0.05 mm ;

Image recognition : + / - 0.03 mm (using MNVC (options) + / - 0.04 mm)

Multi-function universal machine

Be imported from JUKI SMT machinewith original packaging

Features:

Machine in addition to the corresponding IC or complex shapes of the opposite sex element, also has a small element of high-speed SMT capacity.

12500 CPH: chip (laser identification/actual production efficiency

1850 CPH: IC (image recognition/actual production efficiency);

3400 CPH: IC (image recognition/using MNVC)

laser stickers picking suction nozzle (4) x 1 & high resolution visual head suction nozzle (1)

0603 (0201) inch chip ~ 0201 mm square element, or 50 * 150 mm;0402 (01005) inch chip for factory option

The image recognition (reflection type/through the recognition, ball recognition, segmentation)