High Speed Placement Machine FX-2 - Beijing Chengliankaida Technology.co.,LTD

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产品名称： High Speed Placement Machine FX-2

上市日期：2009-12-15

Product Parameter
Product Scope
Explanation
Product description
Configuration

1. Substrate size L substrates (410 x 360 mm)

2. Component height of 6 mm specification

3. The element size 0402 (01005) inch chip ~ 33.5 mm components

4. Components SMT chip speed precision components best conditions 0.09 seconds/chip (40000 CPH) IPC9850 40000 CPH component placement speed (chip components) + / - 0.05 mm

5. Components SMT type (converted to 8 mm band) up to 80 kinds

Be imported juki SMT machine with original packaging

1. Image recognition of laser

2. SMT efficiency increased by 20%, * 1 make economic benefits at the same time, operating performance, reliability of a higher level of high-speed modular SMT machine.

3 40000 CPH (best conditions) (0.09 seconds/chip) * 2 30000 CPH (IPC9850) * 2

4 laser head suction nozzle (12)

5. the element size 0402 (01005) inch chip ~ 33.5 mm square elements