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In order to meet customer production requirements and strengthen equipment flexibility,Now JUKI for KE - 2070 l/CL 1.2 mickey plate models available.Welcome customers to inquire!
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E-mail: 13701235178@163.com
Address: Beijing Tongzhou District, three rooms airport west Wharf Road
Products 产品详情
产品名称: Large Double-group Chamber Vacuum Furnace KD-V6
上市日期:2016-04-07
  • Large Double-group Chamber Vacuum Furnace KD-V6 Large Double-group Chamber Vacuum Furnace KD-V6
  • Product Parameter
  • Product Scope
  • Explanation
  • Product description
  • Configuration

Brand touch screen+PLC controlling system
Welding area:420*550*120mm*3 layers(2 groups)
Furnace height : each layer is 120mm
Single layer weight bearing : 20KG
Standard Soldering temperature : 0-450°C
Optional Soldering temperature : 1200°
Controlling system : Temperature controlling system+
  Vacuum system+Cooling system+ Atmosphere system +software controlling system
Temperature raise rate : ≥120℃/min
 Max temperature cooling rate : ≥60℃/min
Cooling system : water cooling + gas cooling

 

 Power Semiconductors


 Hybrid Microelectronic Assembly


 UHB LED´s


 BGA Flip Chip


 Hermetic Seals Optoelectro


 Optoelectronic Package


 Wafer Level Bump


 MEMS


 IGBT

 

 

Reflow soldering
Typically high number of voids cause a large non conductive area

 

Vacuum soldering
Very low number of voids, Typically < 2 % leads to best Thermal Conduction

 

Void Less

 

Flux Less

 

Ultra Clean

 

 

1. Void Less

Void reduction between the joining partner (<2%) for better heat transfer . (depending on the device surface quality and selection of process gas). below ordinary conditions void of more than 30% , increase bonding strength.

 

2. Excellent Temperature Control

latest PLC archtecture and MFC for precision gas flow control , make temperature consistency and precision temperature control .have a good protection .

Water Cooling system : water cooling tank and cross cooling tube ensure it can cooling rapidly in high temperature environment.

 

3.Very Short Soldering Times

Cycle time is short. welding cycle time about 10 min 。(380-450 ℃ soldering temperature, ooling temperature to 45 ℃。 nitrogen filling, welding vacuum degree is lower than 5*10ˉ¹Pa ), shorter than the other equipment;

 

4. Variation Process gas

Standard : vacuum chamber filling the 100% nitrogen .
Option : 100% hydrogen, N2 & H2 forming gas , HCOOH, ArH2 Plasma process gas

 

 

5. Good human-machine interface

The Windows operating system, provide programming, system status query, system debugging/set, alarm indicator and such as user interface, programming is simple & easy use

 

 6. Advanced PLC and Safety System :

PLC system prevent accidental eg : Hydrogen leakage .
Ultra high temperature alarm, excessive temperature raising alarm
Cooling water pressure detection system, low pressure alarm
HCOOH tank protective cover to prevent accidental explosion of HCOOH tank
Formic acid, hydrogen gas leak detection alarm system
Safety system of automatic pressure relief if over pressure
Hydraulic pallet -- so as to avoid causing water to undertake circuit damage
Automatic hydrogen burning function, Avoiding hydrogen pollution.

 

 

Variation Process gas :

Standard : vacuum chamber filling the 100% nitrogen .


Option : 100% hydrogen, N2 & H2 forming gas , H2, ArH2 Plasma process gas .

 

Oxygen-free soldering

Improved the wetting bahavior

Integrated or separate implementation of cleaning processes for flux-free

Significant increase in yield by wider process window

Rapid heating and cooling ramps , typical 3K/S

No flux residues on product leve

 

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