1. Independent 3 heating zones control system.

A: Up/Down heating zones is hot air heating, IR preheating is infrared heating, accuracy within ±3℃,Up/Down heater can heating from the top of component and bottom of PCB board at same time , also set 6 segment temperature control ;IR preheating can based on the requirement to adjust heating area, make PCB heated evenly.

B: Can local heating for BGA chip and PCB board by hot air, also infrared heaters to preheat the bottom of the PCB board, can completely avoid the deformation of the PCB in the process of repair. Can select use upper or down heating zones alone, and freely combination the energy from up and down heating zones.

C: Select high precision K-type closed-loop thermocouple and PID parameters self-tuning system; At same time can show 7 temperature curve and save many groups user datas, and can copy and save the datas by USB, along with the function to analysis the curve instantaneous; External temperature testing interface implementation for detecting the precision of temperature, can analysis and proofreading the BGA temperature curve at any time.

2.Precision optical alignment system ,use CCD color optical visual registration system.

Precision optical alignment system ,Use CCD color optical visual registration system, with the function of spectral, amplification, narrow, trimming and manual focus, and equipped with automatic color resolution and brightness adjusting device, can adjust Imaging resolution, With 15 "high-definition LCD.

3.Multi-function humanized operating system.

A:Use the man-machine touch screen interface, this interface can be set “ Adjust interface” and “ Operate interface”, In case the mistake in the working; Integrated design of upper heating device and chip head, drives. Z axis move is Stepping control system, can precise control position and heating point; Can automatic identification the height of pick and place . With functions of automatic welding and desoldering ,and Equipped with a variety of specifications titanium alloy BGA wind mouth, It can be 360 ° arbitrary rotation, it is convenience for installation and exchange. With infrared laser rapid positioning.

B: To guarantee the magnification invariable, at same time can control optical lens moving around ,from all side to observation the position situation and center point of BGA chip, avoid the problem of “missing inspect”; X, Y and R axis adopt micrometer fine-tuning , High-Precision positioning, it can achieve to ±0.01mm.

C:Can save multiple temperature setting parameters and memory different groups heating and position point of BGA chip, and can analysis ,set and adjust for temperature curve at any time; The machine does not need to rely on an external device (computer) and can through USB port to download, print, save, and analysis curve.  

D: PCB board position use V-type, Positioning quickly , convenience and accurately, and meet position for different PCB layout and size; To ensure the success rate of repair, can adapt to repair of difference kinds of BGA package size .