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2015 - 12 - 17
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The twenty-first Southern China international electronic production equipment, the microelectronics industry exhibition (NEPCON)Time: August 25, 2015 -27 daysAddress: Shenzhen International Convention...
2015 - 12 - 17
点击次数: 270
In order to meet customer production requirements and strengthen equipment flexibility,Now JUKI for KE - 2070 l/CL 1.2 mickey plate models available.Welcome customers to inquire!
2015 - 12 - 17
点击次数: 190
Electronic production equipment exhibition, Shanghai, Munich, 2015:Time: March 17, 2015 -19 daysLocation: Chinese - Shanghai New International Expo Center Hall E2 E1, our booth No.: E1, booth 1316A wa...
2015 - 12 - 17
点击次数: 182
April 2015 NEPCON (China International Electronic Equipment Exhibition):Time: April 21, 2015 -23Venue: Shanghai World Expo exhibition hall 1. (No. 7, No. 8 line available)Exhibition hall: hall 1, visi...
2015 - 12 - 17
点击次数: 174
Guangzhou international lighting fair in June, 2015:Time: June 9-12, 2015Location: guangzhou (the China import and export fair pazhou hall)Gallery: D16 # 9.1JUKI SMT machine cheng lian kai da technolo...
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Address: Beijing Tongzhou District, three rooms airport west Wharf Road
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1.Work style: 2.5 d double processing way. 2 Control handle is composed of ARM + FPGA embedded control system, control handle with double USB interface, which can realize master-slave USB communication mode, namely as the main USB devices directly read U disk data, as from a USB device and computer communication, can completely escape Computer work; 3. Full modular drive way, 3 + stepper motor module driver chip joint driver XYZ axis movement; 4.All casting body, Y axis movement driving beam arm movement, in the process of engraving and drilling, circuit board still has no displacement; 5.Random configuration processing auxiliary data processing software, without any external software to realize the data directly into the machine; 6.Equipment with X, Y, Z axis limi...
Our Advantage : 1. Visual system Camera system: 2 million pixels (1600 * 1200) full color high speed digital CCD camera.Lighting system: three-channel white LED light or RGB light  source. 2. Mechanical system :X/Y drive system: AC servo motor+ precision ball screw  grinding .Splint way: automatic fixture .Positioning accuracy: Move speed: 800 mm/s (MAX).Track adjustment: manually. 3. Software system :Operating system: Windows XPInterface language: Chinese, English optional .Output of test results: substrate ID, name of the base board,Component name, name of defect,defect images.
The heating type : hot air heating ,Uninterrupted soldering LED,SMT,BGA /CSP components.Crawler-type and 4 temperature zones heating systemsEach zone uses independent PID controlling and up-down heating typeProgrammable technology and SSR Radiator, PID intelligent temperature control technologyImported frequency conversion motor ,Lead rail + mesh belt transportation modeSpeed adjustable range 0-1500mm/min.Independent wheel structure and Stainless steel mesh beltSpeed precision can reach ±10mm/min. Abnormal temperature alarm deviceEasy operate, LCD display, no need connect with the PCGood build quality, easy transportation or storage.
Whole machine for lead-free process design , Germany's SIEMENS PLC Control  Synchronized into the plate body, import transport , power with stability transport . High efficiency infrared preheating ceramic tube heating, thermal performance, high stability.   low oxidation corrosion lead-free tin furnace, energy saving nozzle design meet lead-free soldering requirements. Tin stove adopts the external heating type heating plate safe and efficient. With sound and light alarm and emergency brake device. Small structural design, suitable for small batch production and laboratory . Streamline appearance design, flexible & easy cleaning
PCB Parameters Maximum PCB Size 450mm x 340mmMinimum PCB Size 50mm x 50mmPCB Thickness0.4mm~6mmPCB WarpageMax. PCB Diagonal 1% Max.Maximum PCB Weight 6KgPlate Edge ClearanceUp to 3mm Maximum Bottom Clearance 16mmSpeed of Transmission 1500mm/秒Second(Max)Apart from the Ground Transmission Height 900±40mmTransfer Orbit Direction Left-Right, Right-Left, Left-Left, Right-RightTransmission ModeOne Stage Clamping Direction of PCB Top parallelogram plate institutions flatten software adjustable elastic pressure side pressure, the bottom of the overall multi-point partial vacuum or suction vacuum Board Support Method Magnetic Pin/Contour Blocks/Special Workpiece Fixture
Reflow soldering Typically high number of voids cause a large non conductive area Vacuum soldering Very low number of voids, Typically  Void Less Flux Less Ultra Clean
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